Customized On-Shore IC Solutions

Trusted Semiconductor Solutions' Backend Manufacturing Services

Providing IC test and packaging services is a core area for TSS. We have engaged in specialized package process development, high pin-count, high performance flip-chip BGA/CGA packaging, known-good-die testing, upscreening of commercial parts and production part qualification (QML equivalent flows). Our on-shore, ITAR-compliant capabilities cover:

TSS provides test services for semiconductor wafers, die, and packaged parts. Our test engineering team ensures that an optimal test strategy is developed for each IC. This includes implementing design-for-test at the earliest stages of the chip design flow, and beginning test software development during the initial design architecture stage.

We work with leading on-shore semiconductor test facilities to perform wafer/die level test, final IC test and radiation testing. Tests are available for digital, analog, RF, and mixed-signal technologies. Test development offerings include the entire spectrum of test engineering services from test program development to full product characterization, and complete reliability/qualification testing. Our test facilities are ISO, DSCC and QML certified and comply with industry standards.

TSS also offers packaging solutions through our US-based supply chain. Our on-shore partnerships, along with our in-house package development team, allow us to offer state-of-the-art packaging solutions. Available packaging services include wafer saw, wafer thinning, package design, package modeling, and package assembly.

Package Technologies

• Laminated or Molded Plastic

• Multi-layer Ceramic

• Printed Circuit Board

• Multi-chip Modules or System in Package Options

• Stacked Die (3-D)

• Die bond with soler, eutectic, epoxy or glass

• Flip chip, Surface mount, Thru-hole package bonding

• Hermetically sealed