|
|
|
Customized
IC Solutions
for |
|
|
|
Customized
IC Solutions
for |
|
Providing
IC test and packaging services is a core area for TSS. We have
engaged in specialized package process development, high pin-count,
high
performance flip-chip BGA/CGA packaging, known-good-die testing,
upscreening of
commercial parts for military use and production part qualification for
space
applications (QML equivalent flows). Our on-shore, ITAR compliant
capabilities
cover:
TSS provides test services for semiconductor wafers, die, and packaged parts. Our test engineering team ensures that an optimal test strategy is developed for each IC. This includes implementing design-for-test at the earliest stages of the chip design flow, and beginning test software development during the initial design architecture stage. We work
with leading on-shore semiconductor test facilities to perform
wafer/die level test, final IC test and radiation testing. Tests are
available for digital, analog, RF, and mixed signal technologies.
Test development offerings include the entire spectrum of test
engineering services from test program development to full product
characterization, and complete reliability/qualification testing. Our
test facilities are ISO, DSCC and QML certified and comply with
industry standards, including JEDEC, MIL-STD 883, and others. TSS also offers packaging solutions through our US-based supply chain. Our on-shore partnerships, along with our in-house package development team, allow us to offer state-of-the-art packaging solutions specifically for mil-aero and space markets. Available packaging services include wafer saw, wafer thinning, package design, package modeling, and package assembly. Package Technologies
|
Trusted
Semiconductor Solutions' Backend Manufacturing Services