Customized On-Shore IC Solutions

Trusted Semiconductor Solutions' Management Team

Our management team brings extensive experience developing and delivering custom semiconductors. They are veterans in semiconductor design and experts in their respective fields. Their respective engineering teams support system design, IC design, IP development/integration, test development, packaging, and quality assurance. Trusted Semiconductor Solutions' staff also includes legal counsel, finance, accounting, IT, and operations.

Allan Hurst, Jr. - President and CEO

Trusted Semiconductor Solutions' president and CEO is a leading authority on the Military and Aerospace market segment. He has over 20 years of proven management, sales, marketing, engineering, and technology development experience from his career at Honeywell International's Solid State Electronics Center. His outstanding technical achievements were rewarded by Honeywell's H.W. Sweatt Engineering / Scientist Award and the 20 U.S. patents he holds related to the design, fabrication, and packaging of nonvolatile memory products. He holds a BS in electrical engineering from the University of Minnesota.

As president and CEO, he is responsible for setting the tone and personality of the company and has oversight of all aspects of the company’s operations including personnel, strategy, and image. He believes in an open and respectful relationship with Trusted Semiconductor Solutions' customers, suppliers, and employees.

Stephanie Pusch - Vice President of Sales and Marketing

Trusted Semiconductor Solutions' vice president of sales and marketing has 15 years of experience in the field of technology, with positions in engineering, sales and business development. Most recently she was a business development manager for Honeywell's Solid State Electronics Center. Prior to Honeywell, she held application engineering and sales roles at Cadence Design Systems and ASIC and FPGA design engineering roles at Motorola. She holds an MS in electrical engineering from Illinois Institute of Technology and a BS in electrical engineering from the University of Wisconsin - Madison.

Dan Kagey - Director of Technology

Trusted Semiconductor Solutions' director of technology brings over 30 years of relevant ASIC design engineering, technology development and business development to Trusted Semiconductor Solutions. Most recently, he was at Honeywell's Microelectronics Technology Center as a director of business development and a director of advanced technology. Prior to Honeywell, he acted as director of engineering for Allied/Signal MTC. He is an expert in semiconductor technology and design methodologies and has spent over 15 years providing custom ASICs to the secured communication industry and the radiation hardened space markets.

Doug McKenney - Director of ASIC Engineering

Trusted Semiconductor Solutions' director of ASIC engineering brings over 20 years of commercial ASIC design experience to Trusted Semiconductor Solutions. For the last 17 years, Mr. McKenney held various design and management positions at LSI Logic. His strengths lie in the areas of IP development and integration for system-on-chip applications. He is experienced in high-speed, low-power, digital logic design, and the integration of digital and analog IP. He has developed ARM, MIPS, ZSP, and PowerPC processor systems with peripherals utilizing the AMBA and CoreConnect bus. IP integration experience includes ethernet, USB, SERDES, DDR2, PCI Express, and data converters. Mr. McKenney leads the ASIC development team and the Trusted IP initiative at TSS.

Ed Albers - Director of Program Management

Trusted Semiconductor Solutions' director of program management brings over 40 years of semiconductor engineering, manufacturing, operations and management experience to Trusted Semiconductor Solutions. He spent 24 years at Honeywell’s Solid State Electronics Center, serving as director of product development and design technology, director of manufacturing, director of quality and program manager for strategic mil-aero programs. Prior to Honeywell, he held product engineering and product line management positions at National Semiconductor and product engineering roles at Texas Instruments. He holds an MS in electrical engineering from Southern Methodist University, a BS in electrical engineering from the University of Detroit, and a BA in math from Bellarmine College.

Harold Diederich - Director of Test Solutions

Trusted Semiconductor Solutions' test manager has over 40 years of semiconductor test engineering and test operations experience. He spent the last 30+ years at Honeywell’s Solid State Electronics Center where he served as manager of material management, manager of procurement, manager of product engineering and as a program manager. He was instrumental in creating a world-class test facility for testing ASICs, memories, analog ICs and sensor devices. He started his career at Collins Radio (Rockwell International) where he was a manufacturing test engineer. He holds a BS in electrical engineering from the Milwaukee School of Engineering and attended the University of Iowa with several credits towards an MBA degree.

Chuck Speerschneider - Director of Packaging Solutions

Trusted Semiconductor Solutions' packaging manager has over 30 years experience as a materials/process engineer specializing in electronics packaging. Most recently, he worked at Honeywell International on research, development and production of high speed, sophisticated integrated circuit packaging. For the past 20 years he has worked on or directed projects/programs in electronics packaging including surface mounting of chip carriers on PWBs, chip on board packaging, packaging for high speed digital systems (GaAs), and multichip packaging for high performance systems. The emphasis in this work has been on materials and processes for package assembly; this includes die attach, wire bonding, tape automated bonding, flip chip bonding, hermetic sealing, failure analysis, and package screening.

Phil Brusius - Director of Quality and Reliability

Trusted Semiconductor Solutions' packaging manager brings nearly 40 years of quality, reliability, and packaging experience to Trusted Semiconductor Solutions. For the last 28 years he worked at Honeywell's Solid State Electronics Center as a lead engineer and manager on Honeywell’s high-reliability QML line. As a certified six-sigma engineer, he assured compliance to QML/mil-std specifications. His specialties are in wear-out mechanisms such as electro-migration, time dependent dielectric breakdown, hot carrier effects, and negative bias temperature instability. He also worked on the quality and reliability aspects of high temperature. Prior to Honeywell, Mr. Brusius worked at NASA's Goddard Space Flight Center as a failure analysis engineer, and for the DOD as a packaging engineer. Mr. Brusius holds a BS and MS in electrical engineering from the University of Wisconsin, Madison.