After IC design, we provide semiconductor fabrication, wafer processing, IC packaging
and IC test. Our strategic on-shore and off-shore partners give us the flexibility
to create the best technical/economical solution for your needs. And our manufacturing
expertise allows us to create unique package and test options, such as a reliable,
low cost known-good-die test methodology and custom IC packages.
Our semiconductor foundry partners offer over twenty-five (25) years of process technology,
providing platforms for advanced high performance integrated circuits and legacy
part replacements. ITAR compliant foundry options are available.
• CMOS technology from 0.5 micron down to 28nm
• BiCMOS technology with SiGe transistors from 500nm to 90nm
• SOI technology in 130nm, 90nm, 45nm, and 32nm
• SiGe technology for high speed applications
Our wafer processing capabilities include anything performed on the wafers post fab
and prior to packaging. This includes wafer probe, wafer thinning, dicing and sorting,
silicon etch, and wafer bumping.
Our unique known-good-die (KGD) testing process provides fully-qualified and screened
die for multi-chip-modules (MCMs), flip-chip packaging, or system-in-package (SIP).
The process meets MIL-STD test requirements and is ITAR compliant.
Our package development team and IC assembly partners provide state-of-the-art packaging
solutions, including custom package design, modeling, and assembly.
Trusted Semiconductor Solutions deplores the violence in the DRC and adjoining countries
and is committed to supporting responsible sourcing of conflict minerals from the
region. Accordingly, Trusted Semiconductor Solutions has adopted a conflict minerals
policy, as part of Trusted Semiconductor Solutions’ Supply Chain Policies: EHS, Transportation,
Labor/Human Resources and Supplied Materials. Trusted Semiconductor Solutions expects
its suppliers to adopt a similar policy and to meet the expectations set out below.